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RFS 100

DIS Web

Precise Visual Lay-Up, Alignment & Bonding of Multilayers

 

 

The RFS -100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs  and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

RFS 100 

 
 

  

 

 

 

 


FEATURES

  • Optically align and bond Rigid, Flex and Rigid-flex boards
  • The system will process all panel sizes from 305 x 355mm to 610 x 760mm (12” x 14” to 24” x 30” )
  • Simple touch screen controls
  • Ideal for prototype, small volume and high mix production

All information subjected to change without notice!

For more information, visit the website or send us your information request. 

 

About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

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