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RFS-100

Precise Visual Lay-Up, Alignment & Bonding of MultilayersDIS Web

 

This system has seen itsWorld Premiere during the Productronica show of 2017 in Munich from November 14 through to November 17!

RFS 100

The RFS -100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs  and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

 

 

 

 

  

About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

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