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Precise Visual Lay-Up, Alignment & Bonding of MultilayersDIS Web


This system has seen itsWorld Premiere during the Productronica show of 2017 in Munich from November 14 through to November 17!

RFS 100

The RFS -100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs  and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.