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Multilayer Bonding

Overview Multilayer Bonding

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Pinless Registration System

The PRS Direct Optical Registration System allows for optical lay-up of multilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

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PRS Standard

NO

1

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Pinless Registration System

The PRS Direct Optical Registration System Allows for optical lay-up of multilayers and sequential lamination buid up technology, Three different processes take place in one unit; lay up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

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PRS L/U

NO

2

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Pinless Registration System

The PRS Shuttle Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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PRS Shuttle

NO

3

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Pinless Registration System

The PRS Shuttle advanced Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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PRS Shuttle Advanced

NO

4

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

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PWS 100

NO

5

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

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PWS Shuttle

NO

6

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Rigid-Flex System

The RFS 100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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RFS 100

NO

7

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