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Phoenix Maxima

CIMS 2 2018AOI for IC Substrates and ultra fine line HDI with min line/space down to 10 µm.

Phoenix Maxima, CIMS latest generation of AOI system, is designed to support high volume manufacturing of IC Substrates and ultra fine line HDI. It is capable to scan down to 10 µm line/space width technology.

The system’s state of the art optical technology Prisma™ is designed to provide flexible light coverage with maximum contrast in order to support high resolution image acquisition at high scanning speed. Optimized performance is achieved by combining sharp high resolution image with customizable detection algorithms.

Phoenix R2R maxima 8pngEquipped with the state-of-the-art image acquisition and advanced software capabilities, the Phoenix product family is renown for its exceptional detection achieved with lowest possible false calls rate.

Phoenix Maxima is powered by Spark™ - an innovative cross-platform detection engine.

 Product Highlights

  • New linear motors for smooth & silent motion
  • Robust structure
  • Automated vacuum table
  • Prisma  illumination
  • 64 bit based firmware
  • Powerful processors to handle high density PCB
  • Compatible with all types of R2R automation
  • Simple and quick setting for new jobs

Optional Features

  • +2DM metrology - panel dimensions measurement
  • +2CD metrology - 2D measurments of circuit elements
  • +3DH metrology - 3D measurements of circuit's element height
  • +3DP metrology – 3D profiling of circuit element
  • FI - final inspection for finished bare boards
  • LDI - laser drill inspection
  • CDB/CDBIC - defects classification and virtual defects mapping
  • VVS - virtual verification system

  microlight spark



All information subject to change without notice!

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