Fully automated Flying Probe Test System optimized for HDI products
Key Features
- For complete lights out operation
- Dual Shuttle System allowing:
>> Highest throughput
>> zero seconds product exchange time - 8 test heads
- small footprint
Board Handling
- Max. Panelsize: 460mm x 330mm (28.1" x 13")
- Min. Panelsize: 50 x 40mm (2" x 1.6")
- Test area: 460 x 310mm (18.1” x 12.2” )
- Board thickness: up to 5 mm, max 2kg
- Cycle time automation: 0 s with dual shuttle mode for test area max. 300 x 310mm
< 15 s with single shuttle mode - Loader capacity 390mm 240 boards / 1.6mm thick
- 8 Test heads (4 top / 4 bottom)
- 4 color cameras for fast optical scanning of top and bottom side
Resolution 9µm pixel - Smallest Pad size: 35 µm (1.4 mil)* (with micro probes and glass calibration)
- Smallest Pitch: 80 µm (3.2 mil)
- Resolution measurement system: ± 1µm (± 0.04mil)
- Repeatable accuracy ± 4µm (± 0.16mil)
- Soft Touch Probes pressure 5g to 15g
- Micro Needle Probes pressure 0.3g to 2.5g
Electronics
- Continuity test 1 Ω - 10 kΩ
- Isolation test
• up to 25MΩ (FM)
• up to 10GΩ (Ohmic)
• MicroShort Detection® - Test voltage: 100mV to 1000V optional
Options
- 4-wire Kelvin measurement with max. 300mA test current
• 0.25mΩ to 1kΩ - Tolerance ± 2%, min. ± 0.025mΩ
• with Kelvin probes contact pressure 0.2g to 5g
• Smallest pad: 60µm ( 2.4 mil)*
• Smallest pitch: 100µm ( 4.0 mil)*
* with kelvin probe fine adjustment - Embedded Component test
• R 0.5 Ω - 10 MΩ - Tolerance ± 0.5 %, min. ± 0.5 Ω
> 10 MΩ - 50 MΩ - Tolerance ± 2 %
• C 0.1 pF 100 µF - Tolerance ± 2 %, min. ± 0.03pF
• L 0.2 µH to 5mH - Tolerance ± 3 %, min. ± 0.1µH - Diode Varistor
UF,UR, UBR 100mV to 12.5V
Structural test of integrated circuits
opens/shorts test on CMOS devices with ESD diodes - Multi-Point Measurements (only available with dual shuttle)
Up to three AC/DC sources (voltages and current) simultaneously
Transistors (MOSFET and Bipolar), Optocouplers, Fuses,
Relays, Transformers, etc.
Imax=300mA - LaTest® open detection
• with LaTest® probes - 1g to 10g
• High current - 1.4a (1 Khz) - Layup table for optimized product excchange time in single shuttle mode
- Label printer with barcode suport
- Pen marker
- Retest of fault files from external grid test systems on inquiry
- Repair software with barcode support
- Tensioning modules for flexible board thickness 0,05mm to 1.0mm
General connections
- Data input format: IPC-D-356A
- Network connection: Ethernet, TCP/IP
- Power Supply: 3x400V, 50Hz (3x208V, 60Hz)
1500VA - Compressed air: 8 bar /115 psi filtered
- Temperature: 18°C t0 27°C /66°F to 81°F, ±3K
- Relative humidity: 40% to 60%
- Machine weight: 2100kg
All information subject to change without notice!
For more information, visit the website or send us your information request.