Fully automated Flying Probe Test System optimized for HDI products

Key Features

• For complete lights out operation
• Dual Shuttle System allowing:
  >> Highest throughput
  >> zero seconds product exchange time
• 8 test heads
• small footprint

Board Handling

• Max. Panelsize: 460mm x 330mm (28.1" x 13")
• Min. Panelsize: 50 x 40mm (2" x 1.6")
• Test area: 460 x 310mm (18.1” x 12.2” )
• Board thickness: up to 5 mm, max 2kg
• Cycle time automation:  0 s with dual shuttle mode for test area max. 300 x 310mm
                                      < 15 s with single shuttle mode
  
  
• Loader capacity 390mm 240 boards / 1.6mm thick
  
  
• 8 Test heads (4 top / 4 bottom)
• 4 color cameras for fast optical scanning of top and bottom side
  Resolution 9µm pixel
• Smallest Pad size: 35 µm (1.4 mil)* (with micro probes and glass calibration)
• Smallest Pitch: 80 µm (3.2 mil)
• Resolution measurement system: ± 1µm (± 0.04mil)
• Repeatable accuracy ± 4µm (± 0.16mil)
  
  
• Soft Touch Probes pressure 5g to 15g
• Micro Needle Probes pressure 0.3g to 2.5g

Electronics

• Continuity test 1 Ω - 10 kΩ
• Isolation test
  • up to 25MΩ (FM)
  • up to 10GΩ (Ohmic)
  • MicroShort Detection®
• Test voltage: 100mV to 1000V optional

Options

• 4-wire Kelvin measurement with max. 300mA test current
  • 0.25mΩ to 1kΩ - Tolerance ± 2%, min. ± 0.025mΩ
  • with Kelvin probes contact pressure 0.2g to 5g
  • Smallest pad: 60µm ( 2.4 mil)*
  • Smallest pitch: 100µm ( 4.0 mil)*
  * with kelvin probe fine adjustment
  
  
• Embedded Component test
  • R 0.5 Ω - 10 MΩ - Tolerance ± 0.5 %, min. ± 0.5 Ω
  > 10 MΩ - 50 MΩ - Tolerance ± 2 %
  • C 0.1 pF 100 µF - Tolerance ± 2 %, min. ± 0.03pF
  • L 0.2 µH to 5mH - Tolerance ± 3 %, min. ± 0.1µH
• Diode Varistor
   U_F,U_R, U_BR 100mV to 12.5V 
   Structural test of integrated circuits
   opens/shorts test on CMOS devices with ESD diodes
• Multi-Point Measurements (only available with dual shuttle)
  Up to three AC/DC sources (voltages and current) simultaneously
  Transistors (MOSFET and Bipolar), Optocouplers, Fuses,
  Relays, Transformers, etc.
  Imax=300mA
• LaTest® open detection
  • with LaTest® probes - 1g to 10g
  • High current - 1.4a (1 Khz) 
  
  
• Layup table for optimized product excchange time in single shuttle mode
• Label printer with barcode suport
• Pen marker
• Retest of fault files from external grid test systems on inquiry
• Repair software with barcode support
• Tensioning modules for flexible board thickness 0,05mm to 1.0mm

General connections

• Data input format: IPC-D-356A
• Network connection: Ethernet, TCP/IP
• Power Supply: 3x400V, 50Hz (3x208V, 60Hz)
                           1500VA
• Compressed air: 8 bar /115 psi filtered
• Temperature: 18°C t0 27°C /66°F to 81°F, ±3K
• Relative humidity: 40% to 60%
• Machine weight: 2100kg
  
  
  

All information subject to change without notice!

 
For more information, visit the website or send us your information request.