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A8-a

Fully automated Flying Probe Test System optimized for HDI products

atg A8

Key Features

  • For complete lights out operation
  • Dual Shuttle System allowing:
    >> Highest throughput
    >> zero seconds product exchange time
  • 8 test heads
  • small footprint

Board Handling

  • Max. Panelsize: 460mm x 330mm (28.1" x 13")
  • Min. Panelsize: 50 x 40mm (2" x 1.6")
  • Test area: 460 x 310mm (18.1” x 12.2” )
  • Board thickness: up to 5 mm, max 2kg
  • Cycle time automation:  0 s with dual shuttle mode for test area max. 300 x 310mm
                                        < 15 s with single shuttle mode

  • Loader capacity 390mm 240 boards / 1.6mm thick

  • 8 Test heads (4 top / 4 bottom)
  • 4 color cameras for fast optical scanning of top and bottom side
    Resolution 9µm pixel
  • Smallest Pad size: 35 µm (1.4 mil)* (with micro probes and glass calibration)
  • Smallest Pitch: 80 µm (3.2 mil)
  • Resolution measurement system: ± 1µm (± 0.04mil)
  • Repeatable accuracy ± 4µm (± 0.16mil)

  • Soft Touch Probes pressure 5g to 15g
  • Micro Needle Probes pressure 0.3g to 2.5g

Electronics

  • Continuity test 1 Ω - 10 kΩ
  • Isolation test
    • up to 25MΩ (FM)
    • up to 10GΩ (Ohmic)
    • MicroShort Detection®
  • Test voltage: 100mV to 1000V optional

Options

  • 4-wire Kelvin measurement with max. 300mA test current
    • 0.25mΩ to 1kΩ - Tolerance ± 2%, min. ± 0.025mΩ
    • with Kelvin probes contact pressure 0.2g to 5g
    • Smallest pad: 60µm ( 2.4 mil)*
    • Smallest pitch: 100µm ( 4.0 mil)*
    * with kelvin probe fine adjustment

  • Embedded Component test
    • R 0.5 Ω - 10 MΩ - Tolerance ± 0.5 %, min. ± 0.5 Ω
    > 10 MΩ - 50 MΩ - Tolerance ± 2 %
    • C 0.1 pF 100 µF - Tolerance ± 2 %, min. ± 0.03pF
    • L 0.2 µH to 5mH - Tolerance ± 3 %, min. ± 0.1µH
  • Diode Varistor
     UF,UR, UBR 100mV to 12.5V 
     Structural test of integrated circuits
     opens/shorts test on CMOS devices with ESD diodes
  • Multi-Point Measurements (only available with dual shuttle)
    Up to three AC/DC sources (voltages and current) simultaneously
    Transistors (MOSFET and Bipolar), Optocouplers, Fuses,
    Relays, Transformers, etc.
    Imax=300mA
  • LaTest® open detection
    • with LaTest® probes - 1g to 10g
    • High current - 1.4a (1 Khz) 

  • Layup table for optimized product excchange time in single shuttle mode
  • Label printer with barcode suport
  • Pen marker
  • Retest of fault files from external grid test systems on inquiry
  • Repair software with barcode support
  • Tensioning modules for flexible board thickness 0,05mm to 1.0mm

General connections

  • Data input format: IPC-D-356A
  • Network connection: Ethernet, TCP/IP
  • Power Supply: 3x400V, 50Hz (3x208V, 60Hz)
                             1500VA
  • Compressed air: 8 bar /115 psi filtered
  • Temperature: 18°C t0 27°C /66°F to 81°F, ±3K
  • Relative humidity: 40% to 60%
  • Machine weight: 2100kg


All information subject to change without notice!

 atg LM Logo mit Xcerra groß
For more information, visit the website or send us your information request.