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Overview Planarizing

Planarizing of excess Resin/Paste after the Hole Filling Process is a critical process. Its succes depends on a variety of parameters:

  • Type/Brand of Resin
  • Resin Bump Height
  • Resin Bump hardness
  • Copper thickness on the panel surface
  • Copper Surface flatness & variation
  • Prototype or volume production
  • Operator Skills

PCB manufacturers need to carefully consider these variations when chosing the type of Planarization system. It occurs regularly that PCB manufacturers use a combination of different systems for different variaties of filled via's. ADEON Technologies BV offers a range a Planarization systems in partnership with Mass GmbH and Pola & Massa srl.

  

SV 200 overviewMass - SV-200-WV 

Semi-Automatic Planarizing
with Vacuum Table









 

  

Evo 3000 overviewPola & Massa - Evo-3000

Automatic Single Brush
Capable of Selective Area filling











Pem650 overviewPola & Massa - Pem-650

Multiple Brushes
Higher Volume production





 

 

All information subject to change without notice!

About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

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Contact

Weidehek 26
Industrial Area Haagse Beemden # 4530
NL-4824 AS Breda
The Netherlands
Telephone: (+31) (0)76 541 00 08
Fax: (+31) (0)76 542 50 59
E-mail: info@adeon.nl

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