A8-a
Fully automated Flying Probe Test System optimized for HDI Products
The A8a test system provides the flexibility of flying probe testers while delivering high throughput testing for bare board printed circuit boards (PCBs). The target market for the A8a is the electrical test of tablet and PC motherboards and high density interconnect (HDI) products for smart phones.
The A8a is designed for high productivity, reliability and test accuracy. To achieve high throughput the key feature of the A8a is a new dual shuttle system, which reduces the product exchange time to zero seconds in automation mode. In combination with the fast test speed of up to 140 measurements/second the A8a will give customers a competitive test solution for batches up to 5000 boards. A typical cycle time of a 4-up smart phone board is about 2 minutes.
To ensure accuracy the A8a is equipped with eight test heads and four cameras for optical alignment. The A8a is able to test pad sizes down to 35 micron and is capable of testing HDI products for smart phones or tablet and PC motherboards up to a test area of 18.9” x 12.2”. The A8a eliminates limitations due to test point density or fine-pitch contacts and also features embedded component test or a 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ. The exchangeable clamping and tension bars can handle thin boards, too.
KEY FEATURES
- For complete lights out operation
- Dual Shuttle System allowing:
- Highest throughput
- Zero seconds product exchange time
- 8 test heads
- Small footprint
MACHINE FEATURES
BOARD HANDLING
Max. Panelsize: 480mm x 330mm (18.9" x 13")- Min. Panelsize: 50mm x 40mm (2" x 1.6")
- Test area: 480mm x 310mm (18.9” x 12.2” )
- Board thickness: up to 5mm, max 2kg
- Cycle time automation:
- 0 s with dual shuttle mode for test area max. 300mm x 310mm
- < 15 s with single shuttle mode
- Loader capacity: 390mm 240 boards / 1.6mm thick
- 8 Test heads (4 top / 4 bottom)
- 4 color cameras for fast optical scanning of top and bottom side
- Resolution 9 µm pixel
- Smallest Pad size: 35 µm (1.4 mil)* (with micro probes and glass calibration)
- Smallest Pitch: 80 µm (3.2 mil)
- Resolution measurement system: ± 1µm (± 0.04mil)
- Repeatable accuracy: ± 4µm (± 0.16mil)
- Soft Touch Probes pressure: 5g to 10g
- Micro Needle Probes pressure 0.3g to 2.5g
ELECTRONICS
- Continuity test 1 Ω - 10 kΩ
- Isolation test:
- Up to 25MΩ (FM)
- Up to 100GΩ (Ohmic)
- MicroShort Detection®
- Test voltage: 100mV to 1000V
GENERAL CONNECTIONS
- Data input format: IPC-D-356A
- Network connection: Ethernet, TCP/IP
- Power Supply: 3x400V, 50Hz (3x208V, 60Hz), 1500VA
- Compressed air: 8 bar /115 psi filtered
- Temperature: 18°C to 27°C /66°F to 81°F, ±3K
- Relative humidity: 40% to 60%
- Machine weight: 1900kg
OPTIONS
- 4-wire Kelvin measurement with max. 300mA test current:
- 0mΩ to 1kΩ - Tolerance ± 2%, min. ± 25µΩ
- with Kelvin probes contact pressure 0.3g to 2.5g
- Smallest pad: 60µm (2.4 mil)*
- Smallest pitch: 100µm (4.0 mil)* *with Kelvin probe fine adjustment
- Embedded Component test:
- R 0Ω - 1MΩ - Tolerance ± 1%, min. ± 0.5Ω | 1MΩ - 200MΩ - Tolerance ± 3%
- C 0F - 100µF - Tolerance ± 2%, min. ± 30fF
- L 0H - 10mH - Tolerance ± 5%, min. ± 0.25µH
- Diode/Varistor:
- UF,UR, UBR 100mV to 12.5V
- Structural test of integrated circuits
- Opens/shorts test on CMOS devices with ESD diodes
- Multi-Point Measurements (only available with dual shuttle):
- Up to three AC/DC sources (voltages and current) simultaneously
- Transistors (MOSFET and Bipolar), Optocouplers, Fuses,Relays, Transformers, etc.
- Imax=300mA
- LaTest® open detection:
- With LaTest® probes - 1g to 10g
- High current - 1.4a (1 Khz)
- Layup table for optimized product excchange time in single shuttle mode
- Label printer with barcode suport
- Pen marker
- Retest of fault files from external grid test systems on inquiry
- Repair software with barcode support
- Tensioning modules for flexible board thickness 0,05mm to 1.0mm
RELATED PRODUCTS
All information subject to change without notice!
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