Lodestone

LodeStone_Via_Drilling_for_Flex_PC

Efficient laser cutting of flexible circuits & specialized materials

The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat-affected zones, delivering exceptional accuracy and tight tolerances required by processors.

Inefficient energy absorption is a major cause of poor quality and low throughput in many materials. Ultra-short-pulse lasers can avoid issues associated with poor laser energy absorption due to its cold ablation mechanism. LodeStone™ uses an ESI-designed femtosecond laser with proprietary fiber technology that enables you to process a broader range of material with high quality and productivity.

SPECIFICATIONS

LASER	MATERIAL HANDLING
Femtosecond Green – 12W	Vacuum chuck - 533mm x 635mm (±20um accuracy)
	Electrical and software interface for web and panel handler integration

SUMMERY

MARKETS	APPLICATIONS	MATERIALS
Flex PCB Laser Processing	Flex and interconnect processing	Polyimide (PI)
Rigid-Flex Laser Processing	FPC depaneling	Liquid Crystal Polymer (LCP)
Laser Micromachining	Coverlay routing	Cyclo-Olefin Polymer (COP)
Display and touch panel processing	Touchscreen and polarizer cutting	Polyethylene terephthalate (PET)
	Through via drilling (THV)	Adhesiveless copper-clad polyimide laminates
		Copper-clad polyimide laminates with adhesive
		Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
		Coverlay (Polyimide + Adhesive)