Routing and Through Via Processing
RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as MKS-ESI’s other flex drilling systems, RedStone™ offers an ideal entry point for customers new to flex drilling.
RedStone™ is a high accuracy system with high throughput capabilities while ensuring high process yield. It is the ideal system for processing applications that can be developed with large process windows. Large process window applications examples include through-cut routing, through via applications, larger blind vias on robust flex materials and removing easily-ablated materials from a durable substrate.
SPECIFICATIONS
| LASER | MATERIAL HANDLING |
| Nanosecond UV – 20W | Vacuum chuck - 533mm x 635mm (±20um accuracy) |
| Electrical and software interface for web and panel handler integration |
SUMMERY
| MARKETS | APPLICATIONS | MATERIALS |
| Flex PCB Laser Processing | Through via drilling (THV) | Polyimide (PI) |
| Rigid-Flex Laser Processing | Flex and interconnect processing | Liquid Crystal Polymer (LCP) |
| Laser micromachining | Blind via drilling (BHV) | Adhesiveless copper-clad polyimide laminates |
| Routing | Copper-clad polyimide laminates with adhesive | |
| Coverlay routing | Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid) | |
| Coverlay (Polyimide + Adhesive) |
FEATURES & OPTIONS
- ESI-patented compound beam positioning technology
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 7 interface
- Multi-language operator user inferface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
RELATED PRODUCTS
All information subjected to change without notice!
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