Laser via drilling system for flex PCB processing
Utilizing MKS-ESI’s Third Dynamics™ technology, the 5335™ delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards. It also addresses other high-accuracy laser processing applications such as routing, patterning, and skiving through a combination of MKS-ESI’s patented compound beam positioning and solid-state optical technology.
SPECIFICATIONS
| LASER | MATERIAL HANDLING |
| Nanosecond UV Nd:YAG - 11 W | Vacuum chuck - 533mm x 635mm (±20um accuracy) |
| Electrical and software interface for web and panel handler integration |
SUMMERY
| MARKETS | APPLICATIONS | MATERIALS |
| Flex PCB Laser Processing | Blind via drilling (BHV) | Polyimide (PI) |
| Rigid-Flex Laser Processing | Flex and interconnect processing | Liquid Crystal Polymer (LCP) |
| Laser micromachining | Through via drilling (THV) | Adhesiveless copper-clad polyimide laminates |
| Routing | Copper-clad polyimide laminates with adhesive | |
| Patterning | Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid) | |
| Skiving | Coverlay (Polyimide + Adhesive) | |
| Coverlay routing |
FEATURES & OPTIONS
- Third Dynamics™ beam positioning
- Precision Pulse™ digital power control
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 7 interface
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
RELATED PRODUCTS
All information subjected to change without notice!
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