New-generation laser technology and control capabilities
As a part of MKS-ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone™ significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.
ADVANTAGES CapStone™
- DynaClean™ CapStone’s blind via processing speeds are significantly higher due to the incorporation of ESI’s new DynaClean™ feature using ESI’s patented esiLens™ technology. In a single pass, DynaClean™ processes both copper opening and dielectric cleaning steps that previously required multiple passes. This eliminates unproductive feature-to-feature movement time and enables significantly faster throughput than the 5335 and other UV laser systems, while delivering the same quality of via formation.
- AcceleDrill™ Building on the 5335’s Third Dynamics™, ESI’s latest evolution of beam positioning technology minimizes heat effects with up to and beyond 10m/s via drilling process velocities. As a part of ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone™ significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.
- esiFlex™ Laser CapStone’s high-performance, custom-designed esiFlex™ Laser drives higher performance while minimizing processing cost.
SPECIFICATIONS
| LASER | MATERIAL HANDLING |
| esiFlex™ high PRF nsec UV | Vacuum chuck - 533mm x 635mm (±15um accuracy) |
| Electrical and software interface for web and panel handler integration |
SUMMERY
| MARKETS | APPLICATIONS | MATERIALS |
| Flex PCB Laser Processing | Blind via drilling (BHV) | Polyimide (PI) |
| Rigid-Flex Laser Processing | Through via drilling (THV) | Liquid Crystal Polymer (LCP) |
| Routing | Adhesiveless copper-clad polyimide laminates | |
| Patterning | Copper-clad polyimide laminates with adhesive | |
| Skiving | Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid) | |
| Coverlay routing | Coverlay (Polyimide + Adhesive) |
FEATURES & OPTIONS
- Acceledrill™ and Third Dynamics™ beam positioning
- Dynaclean™
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 7 interface
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
RELATED PRODUCTS
All information subjected to change without notice!
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