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Laser Drilling Systems

Capstone

CapStone_-__Via_Drilling_for_Flex_PCB
New-generation laser technology and control capabilities


As a part of MKS-ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone™ significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.

 


CapStone™ Advantages

 

  • DynaClean™ CapStone’s blind via processing speeds are significantly higher due to the incorporation of ESI’s new DynaClean™ feature using ESI’s patented esiLens™ technology. In a single pass, DynaClean™ processes both copper opening and dielectric cleaning steps that previously required multiple passes. This eliminates unproductive feature-to-feature movement time and enables significantly faster throughput than the 5335 and other UV laser systems, while delivering the same quality of via formation.
  • AcceleDrill™ Building on the 5335’s Third Dynamics™, ESI’s latest evolution of beam positioning technology minimizes heat effects with up to and beyond 10m/s via drilling process velocities. As a part of ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone™ significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.
  • esiFlex™ Laser CapStone’s high-performance, custom-designed esiFlex™ Laser drives higher performance while minimizing processing cost.


SPECIFICATIONS

LASER MATERIAL HANDLING
esiFlex™ high PRF nsec UV Vacuum chuck - 533mm x 635mm (±15um accuracy)
  Electrical and software interface for web and panel handler integration

 



SUMMERY

MARKETS APPLICATIONS MATERIALS
Flex PCB Laser Processing Blind via drilling (BHV) Polyimide (PI)
Rigid-Flex Laser Processing Through via drilling (THV) Liquid Crystal Polymer (LCP)
  Routing Adhesiveless copper-clad polyimide laminates
  Patterning Copper-clad polyimide laminates with adhesive
  Skiving Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  Coverlay routing Coverlay (Polyimide + Adhesive)

 



FEATURES & OPTIONS

- Acceledrill™ and Third Dynamics™ beam positioning
- Dynaclean™
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 7 interface
- Multi-language operator user interface
- Sophisticated process development functionalit
- Comprehensive logging and diagnostics functionality

 



RELATED PRODUCTS

5335 Via Drilling for Flex PCB Redstone Via drilling for FLex PCB Automation Rollmaster 

 


About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

Contact

Weidehek 26
Industrial Area Haagse Beemden # 4530
NL-4824 AS Breda
The Netherlands
Telephone: (+31) (0)76 541 00 08
Fax: (+31) (0)76 542 50 59
E-mail: info@adeon.nl

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