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Overview Laser Drilling

Overview Laser Drilling Solutions

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PCB Flex Laser Via Drilling

As a part of MKS-ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning.

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Capstone

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PCB Flex Laser Via Drilling

Utilizing MKS-ESI’s Third Dynamics™ technology, the 5335™ delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards.

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5335

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2

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PCB Flex Laser Via Drilling

RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as MKS-ESI’s other flex drilling systems, RedStone™ offers an ideal entry point for customers new to flex drilling.

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RedStone

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3

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PCB Flex Laser Via Drilling

The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat-affected zones, delivering exceptional accuracy and tight tolerances required by processors.

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LodeStone

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4

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High Density Interconnect

High-volume manufacturing of High Density Interconnect (HDI) PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale.

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Geode

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5

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High Density Interconnect

High-volume manufacturing of High Density Interconnect (HDI) PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale.

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NViant

NO

6

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Automation

As flexible circuits grow thinner and more sensitive to contamination material, automation becomes an interesting accessory for PCB drilling equipment.

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RollMaster

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