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Laser Drilling Systems

High Density Interconnect

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High-volume manufacturing of High Density Interconnect (HDI) PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. MKS-ESI’s HDI systems enable HDI manufacturers to drill vias
in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials.

Advantages of MKS-ESI’s HDI solutions are ESI’s expertise in laser processing, great reliability at high quality output, lowest cost of ownership and professional sevice and support througout the world. 

>> Read more about Geode™
>> Read more about nViant™

 

geode composite     NviantGeode CEO2 Via Drilling

 

About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

Contact

Weidehek 26
Industrial Area Haagse Beemden # 4530
NL-4824 AS Breda
The Netherlands
Telephone: (+31) (0)76 541 00 08
Fax: (+31) (0)76 542 50 59
E-mail: info@adeon.nl

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