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Overview Multilayer Bonding

Overview Multilayer Bonding

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Pinless Registration System

The PRS Direct Optical Registration System allows for optical lay-up of multilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

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PRS Standard

NO

1

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Pinless Registration System

The PRS Direct Optical Registration System Allows for optical lay-up of multilayers and sequential lamination buid up technology, Three different processes take place in one unit; lay up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

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PRS L/U

NO

2

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Pinless Registration System

The PRS Shuttle Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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PRS Shuttle

NO

3

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Pinless Registration System

The PRS Shuttle advanced Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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PRS Shuttle Advanced

NO

4

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

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PWS 100

NO

5

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

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PWS Shuttle

NO

6

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Rigid-Flex System

The RFS 100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

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RFS 100

NO

7

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Multilayer Bonding

Overview Multilayer Bonding

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Pinless Registration System

The PRS Direct Optical Registration System allows for optical lay-up of multilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

Read More

PRS Standard

NO

1

<

>

Pinless Registration System

The PRS Direct Optical Registration System Allows for optical lay-up of multilayers and sequential lamination buid up technology, Three different processes take place in one unit; lay up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination.

Read More

PRS L/U

NO

2

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>

Pinless Registration System

The PRS Shuttle Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

Read More

PRS Shuttle

NO

3

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>

Pinless Registration System

The PRS Shuttle advanced Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

Read More

PRS Shuttle Advanced

NO

4

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

Read More

PWS 100

NO

5

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Pin Welding System

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together.

Read More

PWS Shuttle

NO

6

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Rigid-Flex System

The RFS 100 Optical Registration System allows for pinless lamination of multilayers, Rigid and Rigid-Flex pcbs and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.

Read More

RFS 100

NO

7

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PWS 100

DIS Web

Precise Lay-up, Alignment and Welding of Multilayers


PWS 100The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together. Three different processes take place in one unit; lay-up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination or rivet deformation.

The system may be used to weld a miltilayer, as in conventional laminanation or to align and weld two or more multilayer subassemblies. The SmartWeld Technology allows the user to have complete and independent control of the heating and cooling times as well as bonding pressure.

 

ADVANTAGES 

  • Alignment and layer clamping are made in the same location, there is no chance for critical parts wearing and therefore greater accuracy is assured
  • No need to pre-stack; this eliminates extra handling and possible damage to the cores
  • After set-up, cameras are locked in position, resulting in greater accuracy
  • Using the “Unique Target Layers” software allows the machine to mistake proof the build. If the operator places the cores out of sequence the machine will reject misplaced core
  • Fixed focus lenses with over 8mm range of focus, lenses do not move for focus
  • All slides and moving parts are designed to work in dusty prepreg environment
  • No templates required, can process all panel sizes without needing to change any expensive parts, no tools needed
  • Vision system checks position before and after clamping each core
  • Operator loads core and prepreg at the same time on pre-load station
  • Layers can be loaded with certain types of slip sheets if customer requires
  • Programmable weld profiles, including ramp up, hold time and cool down. Similar to a press profile.

MACHINE FEATURES

  • Panel Sizes from 255 x 305mm to 533 x 635mm (10"x 12" to 21" x 25")
  • Welding profiles are stored via a touch control interface
  • A program enables full control of the weld time, hold time and cooling time
  • Alignment pins at the centerline locations
  • Pin cross bar allows lay-up of a second panel while the first panel is being welded
  • No templates needed
  • Quick and even release of welded panel from pins
  • Designed for maximum value in a PXB shop

  RELATED PRODUCTS

 
PWS Shuttle
     


All information subjected to change without notice!

For more information, visit the website or send us your information request. 

 

PWS Shuttle

 DIS Web

Precise Lay-up, Alignment and Welding of Multilayers

PWS Shuttle

The Pin Welding System is designed to align and bond layers together prior to lamination. The aligned package may be inner layers, laminated sub-assemblies or a combination of both. Controlled heating and pressure are used to activate the prepreg at four locations, which we cooled, form a cross-linked bond site that adheres the various layers together. Three different processes take place in one unit; lay-up,layer to layer alignment and welding. This process eliminates the added tolerances associated with pin lamination or rivet deformation.

The system may be used to weld a miltilayer, as in conventional laminanation or to align and weld two or more multilayer subassemblies. The SmartWeld Technology allows the user to have complete and independent control of the heating and cooling times as well as bonding pressure.  


ADVANTAGES 

  • Alignment and layer clamping are made in the same location, there is no chance for critical parts wearing and therefore greater accuracy is assured
  • No need to pre-stack; this eliminates extra handling and possible damage to the cores
  • After set-up, cameras are locked in position, resulting in greater accuracy
  • Using the “Unique Target Layers” software allows the machine to mistake proof the build. If the operator places the cores out of sequence the machine will reject misplaced core
  • Fixed focus lenses with over 8mm range of focus, lenses do not move for focus
  • All slides and moving parts are designed to work in dusty prepreg environment
  • No templates required, can process all panel sizes without needing to change any expensive parts, no tools needed
  • Vision system checks position before and after clamping each core
  • Operator loads core and prepreg at the same time on pre-load station
  • Layers can be loaded with certain types of slip sheets if customer requires
  • Programmable weld profiles, including ramp up, hold time and cool down. Similar to a press profile

MACHINE FEATURES

  • Panel sizes from 255 x 305 mm to 610 x 710mm (10" x 12" to 24" x 28")
  • A program controls the weld time, hold time and cooling time
  • Alignment pins at the centerline locations (specified by customer)
  • No templates needed
  • Dual weld stations for increased throughput
  • Designed for ergonomic throughput in a high volume PCB shop

RELATED PRODUCTS
 
PWS 100
     







All information subjected to change without notice!

For more information, visit the website or send us your information request. 

PRS Shuttle Advanced

DIS Web

Precise Optical Lay-up, Alignment and Welding of Multilayers

 

The PRS Shuttle advanced Direct Optical Registration System allows for optical lamination of miltilayers and sequential lamination build up technology. Three different processes take place in one unit; lay-up, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.


ADVANTAGES

PRS Shuttle Advanced

  • Alignment and layer clamping are made in the same location, there is no chance for critical parts wearing and therefore greater accuracy is assured
  • No need to pre-stack; this eliminates extra handling and possible damage to the cores
  • After set-up, cameras are locked in position, resulting in greater accuracy
  • Using the “Unique Target Layers” software allows the machine to mistake proof the build. If the operator places the cores out of sequence the machine will reject misplaced core
  • Fixed focus lenses with over 8mm range of focus, lenses do not move for focus
  • All slides and moving parts are designed to work in dusty prepreg environment
  • No templates required, can process all panel sizes without needing to change any expensive parts, no tools needed
  • Vision system checks position before and after clamping each core
  • Operator loads core and prepreg at the same time on pre-load station
  • Layers can be loaded with certain types of slip sheets if customer requires
  • Programmable weld profiles, including ramp up, hold time and cool down. Similar to a press profile
  • All PRS machines are fully compatible for future upgrading to work with the DataAlign Registration System. This includes the 10 camera CMS – Camera Measurement System. Layer data collection, networking and matching best fitting layers to each other for optimum alignment configuration

MACHINE FEATURES

  • Process all panel sizes from 330 x 355mm to 610 x 760mm (13"x14" to 24"x30")
  • Integrated unloading system
  • Welded panels are picked up, transported to the unload station and placed in a tray or conveyor
  • Ideal for high volume production
  • Dual Weld stations for increased throughput

RELATED PRODUCTS

 
PRS Standard PRS LU    PRS Shuttle

 

 


All information subjected to change without notice!

For more information, visit the website or send us your information request. 

 

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About Adeon

At Adeon we believe that it is the quality of our work that placed us in our current position, and quality is what we try to improve with everything we do. European PCB manufacturers are often challenged to produce many different designs and technology levels every day. This makes it challenging to select and provide equipment that is capable of doing that. Our goal is to offer the best service and support against affordable rates to the highest standards to help our customers to stay at the forefront of technological developments.

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Contact

Weidehek 26
Industrial Area Haagse Beemden # 4530
NL-4824 AS Breda
The Netherlands
Telephone: +31 (0)76 541 00 08
Fax: +31 (0)76 542 50 59
E-mail: info@adeon.nl

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